Global SMT Equipment Market with Focus on Placement and Inspection Equipment: Size (2019-2023)
The report further provides detailed regional analysis of the global SMT placement equipment market by value.
By: Daedal Research
Moreover, the report also assesses the key opportunities in the market and outlines the factors that are and will be driving the growth of the industry. Growth of the overall global SMT equipment has also been forecasted for the years 2019-2023, taking into consideration the previous growth patterns, the growth drivers and the current and future trends.
Fuji Corporation, ASM Pacific Technology (ASM Assembly Systems, LLC), CyberOptics Corporation and HPC Vermögensverwaltung GmbH (Viscom AG) are some of the key operating players in the global SMT equipment market. The four companies have been profiled in the report providing detailed analysis of their financial information and business strategies.
Middle East & Africa
ASM Pacific Technology (ASM Assembly Systems, LLC)
HPC Vermögensverwaltung GmbH (Viscom AG)
Surface Mount Technology or SMT, is a process which attaches electronic components on the Printed Circuit Boards (PCBs). The process had replaced the previously used method, i.e., through-hole technology (THT). The SMT is performed with the help of numerous equipment that are: placement equipment, inspection equipment, soldering equipment, cleaning equipment etc.
The SMT placement equipment or pick-and-place machines, are the machines which are operated to place surface mount devices (SMDs) on the printed circuit boards. The machines are used to provide high precision, high speed for the placement of a wide range of electronic products such as capacitors, resistors etc.
The global SMT equipment market has witnessed stable growth in the past few years and is expected to grow at a progressive rate during the forecasted period (2019-2023). The growth of global SMT equipment market would be supported by the growth drivers such as rising number of electric vehicles, growing consumer electronic devices, increasing number of wearable devices, upsurge in Internet of Things (IoT) connected devices, growth in smartphone penetration, emerging industrial robotics and many other factors.
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