New THine video chipset extends HD video for gaming, cars, robotics, medical gear, 3D and

The new MIPI CSI-2 chipset from THine (THCV241A and THCV242) enables high quality video performance for a wide range of applications.This new chipset allows engineers to extend MIPI CSI-2 transmission from 1 foot to over 15 meters!
By: THine
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SANTA CLARA, Calif. - July 31, 2019 - PRLog -- THine Introduces MIPI CSI-2 4Gbps/lane SerDes Chipset

Provides Designers the ability to extend and aggregate images from Dual HD cameras for greater than 15 meters

Enables new high-performance video capabilities for 3D visualization & recognition, autonomous cars, robotics, medical equipment, gaming, XR devices, etc.

THine®, the leader in high-speed serial interfaces and image signal processing, today announced the high-volume availability of their new MIPI CSI-2 extension chipset, THCV241A and THCV242.

This new chipset allows engineers to extend MIPI CSI-2 transmission from 1 foot to over 15 meters!

These exciting new video chips also enable designs that can receive 2 different video inputs simultaneously, as well as applications that can copy and distribute (simultaneously replicate) 1 video stream into 2.

Demands for higher resolution and/or higher frame rate cameras require MIPI CSI-2 output, which are limited to a short transmission range of approximately 1 foot. THCV241A serializes up to 4 lanes of MIPI CSI-2 signals and converts it into 1 or 2 lanes of V-by-One® HS (developed and owned by THine).

V-by-One® HS technology supports up to 4 Gbps per lane which is robust enough to extend the transmission of 1080p60 2Mpixel uncompressed video for greater than 15 meters with typical cables. THCV241A's 2 lanes of V-by-One® HS supports up to an 8 Gbps data rate with the capability to use the second V-by-One® HS lane to support data copy and distribution (replication) applications.

The THCV242 chip deserializes up to 2 V-by-One® HS lanes back to the original MIPI CSI-2 signal.

The chipset supports "Sub-Link" that aggregates bidirectional low speed signals, such as GPIO. The separation of high speed signal path, V-by-One® HS, and Sub-Link enables easy debugging and gives more choices for physical harnesses including the utilization of Keyssa®'s contactless connection for systems benefiting from or requiring a ruggedized, low latency, detachable camera (

The chipset is now available through major distributors, including Digi-Key (


THine Electronics, Inc.
Takeo Yamamoto:

California Eastern Laboratories, Inc.

Marc Sheade:

Mark Shapiro SRS Tech PR
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Location:Santa Clara - California - United States
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