- March 12, 2019
-- YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year's IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. on May 7, 2019. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill. Please find a summary below:
One of the most essential and difficult aspects of wafer level integration is the requirement for zero outgassing during the underfill curing process. This step is crucial as outgassing can contaminate neighboring components. Additionally, cleaning flux residue is also becoming more difficult as electrical components across all industries are increasing in density and miniaturization. In particular, the automotive industry is growing rapidly in its need for underfills as they can be used to enhance mechanic strength and to absorb stress from CTE mismatch.
In response to this growing need, YINCAE has successfully developed a zero outgassing, flux residue-compatible underfill, the SMT 158HA. This underfill does not require the cleaning of flux residue and has repeatedly demonstrated zero outgassing during the curing process. After curing, the electronic device can pass a 5x 260°C reflow process.
We are looking forward to seeing you at this symposium! We produce cutting-edge products that are unique to the semiconductor industry. We will be available at our booth to talk about our products and answer any questions you may have.
For more information or if you have any questions, please feel free to visit our website at: www.yincae.com
or give us a call at 518-452-2880. We look forward to seeing you there.