Nuvotronics Announces NASA Small Business Innovation Research Award

 
Nuvotronics Award To Enable High Performance, Low Cost Satellite Communications
Nuvotronics Award To Enable High Performance, Low Cost Satellite Communications
DURHAM, N.C. - June 11, 2018 - PRLog -- Nuvotronics Inc. has received a NASA Small Business Innovation Research award for their proposal "Wafer level Integration on PolyStrata® Interposer (WIPI)".  During this development program, Nuvotronics will refine a robust wafer-level integration technology based on their proprietary PolyStrata® Technology. Nuvotronics has proven the viability of this new disruptive wafer level packaging technique, monolithically integrating dis-similar semiconductor substrates such as Si, SiGe, GaAs, GaN and InP on a single wafer.  This technique reduces the interconnect losses, removes the need for wire bonds, and improves thermal dissipation.

The WIPI program will see PolyStrata® Technology processed on 8" wafers, using copper microfabrication to monolithically integrate and interconnect different chips (Low Noise Amplifiers, PAs, Mixers, Switches) into an IC module. To demonstrate the performance of the new wafer level packaging approach, Nuvotronics will fabricate a complete W-band monolithic radiometer IC. The resulting IC will be surface mountable using industry standard reflow processes and will not require wire bonding, high accuracy placement or an expensive RF circuit board. The end goal envisioned by Nuvotronics is to revolutionize the way millimeter wave circuits are fabricated by improving the interconnection performance up to 220 GHz and significantly reducing the packaging cost.

Scott Meller, Acting President of Nuvotronics, stated "the novel capability developed under this NASA award will provide major steps forward, both in government and commercial markets. NASA will directly benefit from the performance advantages and the lower production costs that WIPI will provide on future space based phased arrays and more integrated RF systems such as CubeSat payloads.  Commercially, the technology can benefit E Band and D Band phased arrays required by next generation 5G networks. In this new millimeter wave domain, the challenges of creating circuits become exponentially harder. PolyStrata technology offers a revolutionary solution enabling fabrication of a multi-chip integrated component which can be placed on a standard printed circuit board."

Nuvotronics is a North Carolina based innovator of radio frequency and millimeter wave components and modules that offer substantially higher performance at a fraction of the size and weight.  Their proprietary digital design-to-manufacturing technology is scalable to high-volume production utilizing semi-automated batch processes for parallel additive manufacturing.  Nuvotronics focuses on applications that demand vastly higher system level value, including size, weight, bandwidth, power savings, life cycle cost savings and performance advantages.  These include critical applications in mil/aero markets such as satellite communications, radar, and electronic warfare, and commercial applications such as 5G cellular communications and test & measurement.

www.nuvotronics.com

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Source:Nuvotronics
Email:***@nuvotronics.com Email Verified
Tags:Space, Wafer Scale Packaging, Nasa, Sbir
Industry:Defense, Electronics, Wireless
Location:Durham - North Carolina - United States
Subject:Awards
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