coolingZONE 2015 Announces Dr. Y.C. Lee, Speaking on Flexible Thermal Ground Planes for Wearables

BOSTON - Aug. 18, 2015 - PRLog -- coolingZONE 2015 Thermal Management Summit, A Live Webcast!  Being held October 20-22, 2015, is delighted to announce that Dr. Y.C. Lee, Ph.D., will be speaking on "Flexible Thermal Ground Planes for Smartphones and Wearable Electronics.

About Dr. Lee’s Talk at coolingZONE

A well-known challenge for mobile systems, e.g. smartphones, tablets and wearable electronics, is the control of their skin temperatures, i.e. the temperatures of the case’s exterior surface touched by fingers, ears or other part of a human body. It is essential to keep the skin temperatures lower than 45-50oC for smartphones and 38oC for wearable electronics. Vapor chamber, copper and graphite are recognized as three major thermal management technologies for the skin temperature control. Vapor chamber is known for the best thermal performance; however, it is typically bulky and expensive. A new flexible thermal ground plane (TGP) has been developed to eliminate such thickness and cost barriers. It is named as a thermal ground plane rather than a vapor chamber because it is fabricated using printed circuit board (PCB)-compatible processes. It is low-cost, flexible and thin, e.g. 0.25 mm today and 0.1mm in the future. A flexible TGP is an enabling technology for smartphones and wearable electronics with very thin and/or novel configurations. Such a TGP with effective thermal conductivities 3-7 times that of copper, reduce a mobile system’s skin and junction temperatures with less dimensional constraints in design. A TGP operates with water evaporation, vapor transport, condensation and return liquid flow. The effective thermal conductivities of such a phase-change device vary according to different configurations and thermal loadings. Interestingly, a flexible TGP would reach its best performance when it is used for the skin temperature control.  The 0.25mm thin TGP will be introduced with an emphasis on different effects on its performance.

About Y.C. Lee

Dr. Y. C. Lee is the President and CEO of Kelvin Thermal founded in June 2014. Kelvin Thermal owns exclusive licenses of intellectual properties of flexible thermal ground plane (TGP) established by the University of Colorado Boulder through a DARPA TGP project. Dr. Lee is also the S. J. Archuleta Professor at the Department of Mechanical Engineering, University of Colorado Boulder (CU-Boulder).  From 2006 to 2012, he served as the Director of the DARPA Center for Integrated Micro/Nano-Electromechanical Transducers (iMINT) hosted by CU-Boulder.  From 1993 to 2002, he served as an Associate Director of the National Science Foundation (NSF) Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics (CAMPmode), CU-Boulder. Prior to joining the University in 1989, he was a Member of Technical Staff at AT&T Bell Laboratories, Murray Hill, New Jersey.  Dr. Lee is recognized for his research contributions in packaging and interconnect for microsystems integrating microelectronic, optoelectronic, microwave, and microelectromechanical and nanoelectromechanical devices.   He is the Editor of ASME Journal of Electronic Packaging. He has received the following awards/honors: 1) ASME InterPACK Achievement Award, 2013; 2) ASME Electronic and Photonic Packaging Division’s Mechanics Award, 2007; 3) ASME Fellow, 2002;  4) Presidential Young Investigator Award, NSF, 1990; and 5) Outstanding Young Manufacturing Engineer Award, SME, 1992.

About coolingZONE 2015 Thermal Management Summit, A Live Webcast!

coolingZONE Thermal Management Summit s an engineering and technical conference for all professionals in thermal management, electronics cooling, heat transfer and energy transport.  The event is in its 15th year.

coolingZONE brings together not only theory but solutions from leading technology companies in thermal management.  Our speaker's discuss challenges facing todays and tomorrow’s electronics and concepts and solutions to solve them.  You won’t leave with formulas, you’ll leave with answers and what is on the horizon for your thermal management needs.

Our Live Webcast format allows for the broadest audience from around the world to participate and learn from the world's leading experts in thermal management.

To register for coolingZONE-15 please visit the main conference at http://www.coolingzone.com/event.php?eventid=60