“Equipment & Materials for 3DIC and Wafer-Level-Packaging” added to ReportBuyer.com

The Equipment & Materials business will grow by 4X in the next five years for 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and Flip-chip wafer bumping.
 
 
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Packaging

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• Packaging

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London City - London, Greater - UK

Feb. 8, 2013 - PRLog -- ReportBuyer.com has added a new report http://www.reportbuyer.com/go/YOL00204

Summary of Report -

Equipment & Materials for 3DIC & Wafer-Level-Packaging


The Equipment & Materials business will grow by 4X in the next five years for 3D TSV, FO WLP, 3D WLP, WLCSP, 2.5D interposers and Flip-chip wafer bumping.

EQUIPMENT & MATERIALS SUPPLIERS OF FRONT-END AND BACK-END AREAS ARE FINDING BUSINESS

Demand for Ëœmid-end' tools and related materials is surging, thanks to the growth of 3DIC & Wafer-Level-packaging technologies such as 3D TSV, FO WLP, 3D WLP, WLCSP, 2,5D interposers and Flip-chip wafer bumping.

The material market will grow from ~590M this year to over 2B by 2017 with a CAGR of 24percent, driven mainly by the expansion of 2,5D interposers and 3D TSV& WLP platforms.

Also, the equipment market reached a value of ~870M in 2011 with a CAGR of 28percent fueled by the 3D IC technology with TSV interconnects, which represents one of the main emerging areas in the coming years; an area offering opportunities for new equipment modification and new materials development.

A slight decrease in 2012 is forecast, since manufacturers invested in equipment tools dedicated to the 3D TSV & WLP markets last year and high-volume production in 3D TSV, FO WLP, and 3D WLP has not started yet.

MARKET SHARE FOR 3DIC/WLP: BREAKDOWN BY EQUIPMENT & MATERIALS

The materials market is diversified and segmented into several materials suppliers. Specialist material suppliers are involved and specialized in one specific sector.

However, the equipment market for 3D TSV & WLP applications is quite fragmented and diversified.

We can identify three main groups of equipment suppliers coming from different business markets:

Large equipment suppliers coming from the semiconductor and front“end area who have expanded their business into the 3D TSV & WLP semiconductor business through acquisition of other companies.

Equipment suppliers coming from niche application wafer processing markets with a broad product portfolio.

Specialist equipment suppliers that have developed knowledge and expertise in very specific equipment lines.

The competitive landscape and market share for all main equipment & materials suppliers is quantified and detailed in this report.

COMPLETE TECHNOLOGIES UPDATE FOR EACH TYPE OF EQUIPMENT & MATERIAL USED IN 3D TSV & WLP APPLICATIONS

The wafer-level-packaging market remains a huge business opportunity and shows the greatest potential for significant future growth in the semiconductor industry.

Technologies related to equipment & materials used for different process flows are included in this report.

All key scenarios are analyzed, including flip-chip wafer bumping trends, Fan-in WLCSP, 3D WLP, FOWLP, 2.5D silicon interposers, and 3DIC Via Middle & Via Last processes.

Analysis on the Via first process flow is detailed in this report as well.

DATABASE WITH 375+ KEY EQUIPMENT & MATERIALS SUPPLIERS FOR 3DIC/WLP

Our database is consistently updated with new information on key equipment & materials suppliers.

Along with the new research presented in this updated report, Yole delivers an Excel database which screens and profiles the detailed activity of more than 375+ small, medium and large equipment & materials suppliers coming from either the Front-end, Back-end assembly, PCB, LCD or Solar industries, and providing actual solutions for the 3DIC and wafer-level-packaging toolbox.

One of the main developments this year was the acquisition of NEXX by Tokyo Electron (TEL) in March 2012

KEY FEATURES

2011-2017 wafer forecast for wafer-level-packages, with a unique market segmentation of the different flavors currently blossoming in the mid-end of the semiconductor packaging supply chain: namely Flip-chip wafer bumping, WLCSP, FO WLP, 2.5D interposers and 3DICs with TSV interconnects.

Detailed WLP & other technologies process flows/scenarios analysis, including evidence of the critical steps related to each wafer-level-packaging platform, and what the available technology alternatives are in the equipment & materials toolbox.

WLP equipment & materials market forecasts in unit, volume and revenue from 2011-2017, and 2011 market share of all main equipment & materials suppliers per product line.

An Excel DATABASE screening and profiling the activities of 375+ small, medium and large equipment & materials suppliers coming from either the Front-end/Back-end assembly/PCB/LCD/Solar industries and active in the 3DIC & WLP area

WHO SHOULD BUY THIS REPORT?

Equipment & Materials suppliersr

Assess the TAM “ Total Accessible Market -- of your company's related products in the wafer-level-packaging areasr

Identify technology trends, challenges, and precise requirements for each 3DIC/WLP scenarior

Screen competition activity and identify possible partnerships or targets for M&As in areas close to your current business

R&D organizations & investorsr

Monitor the global activity and consolidation currently occurring in the semiconductor equipment & materials business in order to identify new partners and targets, and make the right decision before committing to one particular supplier

IDMs, CMOS foundries & OSAT playersr

Get an exhaustive list of the 375+ equipment & materials companies supplying solutions in the different 3DIC and wafer-level-packaging areasr

Understand technology trends and benchmark several different 3DIC & WLP scenarios, including the future trends for PANEL scale packaging based on LCD/PCB infrastructures

PCB substrate manufacturersr

Access a complete list of semiconductor packaging equipment & materials companies supplying solutions in the blossoming 3DIC & wafer-level-packaging arear

Identify technology trends, challenges and issues for each 3D packaging scenario

Equipment & Materials for 3DIC and Wafer-Level-Packaging: , is available at:

http://www.reportbuyer.com/industry_manufacturing/packagi...
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