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New Market Research Report: Global Electromagnetic Compatibility (EMC) Shielding Market (2011-2016)
New Computer Technology research report from Markets and Markets is now available from Fast Market Research
Typical materials used for electromagnetic shielding include sheet metal, metal screen, and metal foam. Any holes in the shield or mesh must be significantly smaller than the wavelength of the radiation that is being kept out, or the enclosure will not effectively approximate an unbroken conducting surface.
Full Report Details at
Another commonly used shielding method, especially with electronic goods housed in plastic enclosures, is to coat the inside of the enclosure with a metallic ink or similar material. The ink consists of a carrier material loaded with a suitable metal, typically copper or nickel, in the form of very small particulates. It is sprayed on to the enclosure and, once dry, produces a continuous conductive layer of metal, which can be electrically connected to the chassis ground of the equipment, thus providing effective shielding.
The gradual migration from wired to wireless technology and the emergence of a number of directives and regulations in favor of EMC shielding solutions drive the EMC shielding market. On the other hand, the growing miniaturization of electronic devices, high complexity, and high cost involved largely restrain the growth of the market. In terms of revenue generation, Asia is observed to hold the highest share of around 40%, followed by Europe with 30%.
Amongst the different materials that can be used in the manufacture of EMI shielding solutions, nanomaterials;
The global EMC shielding market is expected to grow from $2,345.39 million in 2009 to $3,788.86 million in 2016 at a CAGR of 7.1% from 2011 to 2016. In addition to strategies such as mergers and acquisitions and joint ventures, the companies are also adopting to newer strategies such as expansion of technology centers by establishing manufacturing facilities in different regions and meeting of various quality standards and attainment of certifications in order to achieve better marketability of their products.
Scope of the report
This EMC Shielding market research report categorizes the global Electromagnetic Compatibility Shielding market on the basis of the different shielding materials, uses of these in various applications, geographical analysis; forecasting revenue and analyzing trends in the market.
On the basis of shielding materials
The material market is segmented into gaskets, tapes, conductive coatings and paints, printed circuit board (PCB) level shielding, and EMI filters. The market trend for these products is discussed.
On the basis of applications
The application market is segmented into military, aerospace and defense, consumer electronics and telecommunications, medical, automotive and others. The market trend for these applications is discussed.
On the basis of geography
Each section will provide market data, market drivers, trends and opportunities, key players, and competitive outlook. This report will also provide market tables for covering the sub-segments and micro-markets. In addition, one would get to scan more than 20 company profiles covering all the sub-segments.
Partial Table of Contents:
1.1 KEY TAKE-AWAYS
1.2 REPORT DESCRIPTION
1.3 MARKETS COVERED
1.5 RESEARCH METHODOLOGY
1.5.1 MARKET SIZE
1.5.2 KEY DATA POINTS TAKEN FROM SECONDARY SOURCES
1.5.3 KEY DATA POINTS FROM PRIMARY SOURCES
1.5.5 LIST OF COMPANIES COVERED DURING PRIMARIES
2 EXECUTIVE SUMMARY
3 MARKET OVERVIEW
3.2 MARKET DEFINITION
3.3 EVOLUTION OF EMC SHIELDING MARKET
3.4 PRICING ANALYSIS
3.5 MARKET DYNAMICS
22.214.171.124 High growth in consumer electronics industry
126.96.36.199 New application trends in new verticals
188.8.131.52 Increased end-user application demand
184.108.40.206 Favorable government norms and regulations against EMI
220.127.116.11 Emergence of WiFi and 3G mobile communications
18.104.22.168 Shrinking size of electronic devices and components
22.214.171.124 Non conformity to policy norms
126.96.36.199 Higher radio frequencies and higher complexity of devices
188.8.131.52 High cost
184.108.40.206 Development of simulation models
220.127.116.11 Development of new materials
3.6 WINNING IMPERATIVES
3.6.1 ENHANCED POLICY NORMS FOR IMPLEMENTATION OF EMC SHIELDING
3.7 BURNING ISSUES
3.7.1 MINIATURIZATION OF ELECTRONIC DEVICES
3.8 EMC SHIELDING MARKET DIRECTIVES AND STANDARDS
3.9 MARKET SHARE ANALYSIS
3.10 PATENT ANALYSIS
4 EMC SHIELDING MATERIALS MARKET
4.1 EMI SHIELDING GASKETS
4.1.1 TYPES OF GASKETS
18.104.22.168 Fabric over foam
22.214.171.124 Finger stock gaskets
126.96.36.199 Mesh gaskets
188.8.131.52 Elastomer gaskets
184.108.40.206 Mixed media gaskets
4.1.2 DRIVERS & RESTRAINTS
220.127.116.11 Operating frequency increases
18.104.22.168 Commercial applications and appliances
22.214.171.124 Reduced corrosion
126.96.36.199 Increasing use in phones
188.8.131.52 EMI leakage
4.2 EMI SHIELDING TAPES
4.2.1 DRIVERS & RESTRAINTS
184.108.40.206 Superior performance
220.127.116.11 Tape weight reduction
18.104.22.168 Mainly used in cables and connectors
22.214.171.124 Inadequate thermal management
4.3 EMI CONDUCTIVE COATINGS AND PAINTS
4.3.1 DRIVERS & RESTRAINTS
126.96.36.199 Miniaturization of devices and components
188.8.131.52 Issue of adhesion
184.108.40.206 Issue of over spraying
220.127.116.11 Issue of high cost
4.4 PRINTED CIRCUIT BOARD (PCB) LEVEL SHIELDING
Full Table of Contents is available at:
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