Next Gen Manufacturing Conference Program Announced

RadTech—UV & EB Technology Expo & Conference April 30 - May 2, 2012 Hyatt Regency Chicago - Chicago, IL
Feb. 21, 2012 - PRLog -- (Bethesda, MD) With a keynote by developers of the world’s lightest structure, ultraviolet (UV) and electron beam (EB) technologies used across the spectrum of U.S. manufacturing will be the focus of RadTech UV & EB Technology Expo & Conference, April 30 - May 2, 2012 in Chicago.  “The re-emergence of US manufacturing is built on technologies that enable better productivity and products, while keeping processes lean, energy efficient and sustainable, “ says Gary Cohen, Executive Director of RadTech.  UV and EB technology is on the forefront of high tech manufacturing and has enabled thousands of unique manufacturing solutions worldwide in industries such as photovoltaics, consumer packaging, wood, automotive, aerospace, and flexible electronics.  Event sessions include:  Graphic Arts; Barrier Coatings & Conductive Films for Flexible Electronics; Harsh environments--corrosion, weathering & exterior; Nanomaterials; LEDs; Rapid Field Applied; and Stereolithography.  Also joining the event are the U.S. Department of Commerce as part of President Obama’s export initiative to discuss expanding exporting opportunities; and on how to benefit from open innovation, including case studies on Touchscreen/Displays, Sustainable packaging, and Food packaging applications.
Event Details:
RadTech—UV & EB Technology Expo & Conference
April 30 - May 2, 2012
Hyatt Regency Chicago - Chicago, IL
Source:RadTech--The Association for UV & EB
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Tags:Sustainability, Printing, uv, eb, Manufacturing, Wood, Electronics, Energy Efficiency, Technology, Finishing
Industry:Manufacturing, Electronics, Environment
Location:United States
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