Recent Study: Global Chip on Board Light Emitting Diode Market (2011 - 2016)

Recently published research from Markets and Markets, "Global Chip on Board Light Emitting Diode Market (2011 - 2016)", is now available at Fast Market Research
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* Application
* Geography
* Lighting
* Patent
* Packaging
* Chip
* Automotive
* North
* Manufacturing

* Computers
* Software
* Technology

* Massachusetts - US

Jan. 15, 2012 - PRLog -- The COB LED market is observed to be growing rapidly as the technology improves and costs go down. The growing demand for energy efficient solutions is helping the industry to gain a consistent market share. The COB-LED module market is expected to exceed the growth of overall LED market in the forecasted period by grabbing the share from DIP-LED and SMD-LED due to having advantages over DIP and SMD, such as higher lumens density, better thermal management, more reliable and longer life, and the most important the small size and many more.

Detail function of LED packaging, packaging substrates, Product range of COB LED is studied.

The report segments different applications such as illumination, backlighting, automotive and others such as used in medical basically in surgical suites. The report also segments by geography such as Asia Pacific, North America and Europe. A detailed study on LED market and COB LED application is mentioned. The report also forecast the future growth of COB LED from 2011 to 2016, market size, application wise total market and their growth, list of leading manufacturer with their profiling, latest technology adopted, M&A's and JV's of key manufacturers.

Full Report Details at

Partial Table of Contents:

Table Of Contents

1 Introduction
1.1 Key Take-aways
1.2 Report Description
1.3 Markets Covered
1.4 Stakeholders
1.5 Research Methodology
1.5.1 Market Size
1.5.2 Key Data Points From Secondary Sources
1.5.3 Key Data Points From Primary Sources
1.5.4 Assumptions Made For This Report
1.5.5 Primary Research Contributors

2 Summary

3 Market Overview
3.1 Introduction
3.2 Market Definition
3.3 Market Dynamics
3.3.1 Drivers Energy efficiency Government support Extremely flat & slim design Longer life span Better color mixing
3.3.2 RESTRAINTS Higher price Complex manufacturing process
3.3.3 OPPORTUNITIES Advancements on design front Market at nascent stage Cost saving
3.4 Burning Issue
3.4.1 Lack Of Awareness
3.5 Winning Imperative
3.5.1 Economy Of Scale
3.6 Cob Led Application Analysis
3.7 Technology Life Cycle Of Cob Led
3.8 Market Share Analysis
3.9 Patent Analysis
3.10 Led Market At A Glance
3.10.1 Definition Of Led
3.10.2 Various Forms Of Led By types By product/usage By application By packaging/technology By material By power/intensity By color
3.10.3 Led Packaging Functions of LED packaging Key components of packaged LED Leading LED packaging companies
3.10.4 Led Value Chain Analysis
3.10.5 Recent Innovation Of Led Technology
3.11 Evolution Of Chip On Board Led Technology
3.11.1 Led As A Cylindrical Device
3.11.2 "T" Or Dip Type Technology
3.11.3 Surface Mount Device
3.11.4 Chip On Board Led

4 Cob Led Technology
4.1 Introduction
4.2 Manufacturing Process Of Cob Led
4.3 Value Chain Analysis Of Cob Led
4.4 Steps In Implementing Cob Led Module
4.4.1 Chip Selection
4.4.2 Packaging
4.4.3 Encapsulation
4.4.4 Pcb Design & Thermo Management
4.4.5 Reliability Test
4.4.6 Run Test
4.5 Chip On Board Led Array
4.6 Led Vs Chip On Board Led

5 Cob Led Application Market
5.1 Cob Led Applications
5.2 Illumination
5.2.1 Residential
5.2.2 Office Space
5.2.3 Industrial
5.2.4 Shop Area
5.2.5 Hospitality Industry
5.2.6 Outdoor Lighting
5.2.7 Architectural
5.3 Automotive
5.3.1 Interior
5.3.2 Exterior Headlamp Sidelight DRLs Rear light
5.4 Backlighting
5.4.1 Led Television
5.4.2 Monitor
5.4.3 Handhelds
5.4.4 Screen Display Lighting
5.5 Others
5.5.1 Medical Equipment
5.5.2 Projectors
5.6 High Brightness Lighting

6 Geographical Analysis
6.1 North America
6.2 Europe
6.3 Apac
6.4 Row

7 Competitive Landscape
7.1 Key Growth Strategies

8 Company Profiles
8.1 Osram
8.1.1 Overview
8.1.2 Products & Services
8.1.3 Financials
8.1.4 Strategy
8.1.5 Developments
8.2 Perkinelmer
8.2.1 Overview
8.2.2 Products & Services
8.2.3 Financials
8.2.4 Strategy
8.2.5 Developments
8.3 Citizen Electronics
8.3.1 Overview
8.3.2 Products & Services
8.3.3 Financials
8.3.4 Developments
8.4 Cree Inc
8.4.1 Overview
8.4.2 Products & Services
8.4.3 Financials
8.4.4 Strategy
8.4.5 Developments
8.5 Seoul Semiconductor
8.5.1 Overview
8.5.2 Products & Services
8.5.3 Financials
8.5.4 Strategy
8.5.5 Developments
8.6 Everlight Electronics
8.6.1 Overview
8.6.2 Products & Services
8.6.3 Financials
8.6.4 Strategy
8.6.5 Developments
8.7 Tridonic
8.7.1 Overview
8.7.2 Products & Services
8.7.3 Financials
8.7.4 Strategy
8.7.5 Developments
8.8 Sharp Electronics
8.8.1 Overview
8.8.2 Products & Services
8.8.3 Financials
8.8.4 Strategy
8.8.5 Developments
8.9 Ge Lighting
8.9.1 Overview
8.9.2 Products & Services
8.9.3 Financials
8.9.4 Strategy
8.9.5 Developments
8.10 Lextar Electronics Corp
8.10.1 Overview
8.10.2 Products & Services
8.10.3 Financials

Full Table of Contents is available at:

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Tags:COB, Application, Geography, Lighting, Patent, Packaging, Chip, Automotive, North, Manufacturing
Industry:Computers, Software, Technology
Location:Massachusetts - United States
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