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Explosion of Smartphones and LTE Phones Buoys the World Handset RF Semiconductor Maket
However, technical complexities and ever-changing customer requirements challenge OEMs
The number of RF semiconductor components in handsets has escalated steeply, increasing the cost share of these components in the baseband module. Handsets that support multi-mode cellular operation are witnessing vigorous uptake and these handsets require more switches to effectively switch between these modes. This has resulted in an upsurge in demand for switches.
New analysis from Frost & Sullivan, World Handset RF Semiconductor Market, finds that the market earned revenues of over $50.0 billion in 2010 and estimates this to reach $74.5 billion in 2015.
If you are interested in a virtual brochure for this study, please send an email to Sarah Saatzer, Corporate Communications, at sarah.saatzer@
“New market penetration, particularly in the developing countries, has triggered a spike in the number of handsets sold worldwide,” says Frost & Sullivan Analyst Prem Kumar Manickam. “With burgeoning mobile sales, the demand for switches has experienced an uptrend.”
On the back of worldwide 3G deployments, the number of services offered to customers has proliferated. New services—such as ground positioning systems (GPS), video calling facility, location based services, etc.—are being offered by network operators, particularly in the developing countries, where 3G is deployed.
To support these new features, high-end phones should be used and this has boosted the demand for RF components. Phones with improved functionality are required in order to receive new services, thus triggering greater demand for new model handsets.
Technical complexity and the ever-changing customer requirements pose impediments for original equipment manufacturers (OEMs). Adding to this complexity is the demand for new functionality from high-end mobiles. Decreasing returns from component sales are also causing angst for participants.
The integration of many components onto a single module poses a greater technical challenge in the baseband design. Board space needs to be at a minimum, yet more components are to be integrated. The level of integration in the front-end module will continue in the future as most chip manufacturers seek to achieve a single chip solution. Effective management of power consumption in the RF components needs to be addressed for overall efficiency of the baseband module.
Going forward, handsets will become more complex in their functionality, due to multi-bands requirements by most customers. Silicon-based complementary metal-oxide-
“Fierce competition in the RF components market demands the adoption of low-cost leadership by the participants to achieve better market positioning,”
World Handset RF Semiconductor Market is part of the Semiconductors Growth Partnership Service program, which also includes research in the mobile handset and smartphone market in India. All research services included in subscriptions provide detailed market opportunities and industry trends that have been evaluated following extensive interviews with market participants.
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Frost & Sullivan, the Growth Partnership Company, partners with clients to accelerate their growth. The company's research and consulting services empower clients to generate, evaluate, and implement effective growth strategies.