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ATS Presents Thermal Management of Electronics Course at coolingZONE Summit in October in Cambridge
Advanced Thermal Solutions, Inc. will present a full-day course: Thermal Management of Electronics – Calculations, Measurements, Simulation, Review and Selection of Cooling Options at the coolingZONE Summit running October 5-6, in Cambridge, MA.
Design engineers are dealing with more heat problems than ever before and the task of mitigating those thermal issues within cost and time constraints have never been more challenging. Dr. Kaveh Azar, a global electronics cooling expert will explain thermal management in a full- day, eight-module course that will provide a thorough, technical overview of cooling basics and the thermal management solution processes.
Attendees at the Thermal Management of Electronics Course will be taken from the basic definition of electronics cooling and why thermal management is required; to how to calculate certain parameters; to how to accurately measure them; and to where and how to use simulation tools like CFD, for effective thermal management. These include:
Fundamentals of Electronics Cooling – what it is; why it needs to be considered; how it is approached and what needs to be considered
Required Calculations in Thermal Management – a set of calculations and respective procedures for analytical modeling of components, boards and systems
Effective Characterization – The Role of Measurement in Thermal Management – basic principles of measurement and proper practices for temperature, velocity, pressure and heat flux
The Role of Software in Thermal Management – CFD Simulation – understanding the fundamentals of CFD simulation and reviewing the best practices in modeling electronic components, boards and systems
Heat Sink Design and Thermal Interface Selection – a review of the heat sink design process and the role of thermal interface material in cooling of electronic components.
Fan Characterization and Its Deployment in Electronic Systems – a review of fan types, their characteristics and best deployment practices, including fan characterization.
Vapor Chamber and Jet Impingement For Thermal Management of High Power Electronics – use of vapor chambers in electronics cooling, along with jet impingement characteristics and its heat transfer benefits/shortfalls.
The Salient Features of Market-Developed Cooling Solutions – cooling solutions that have been developed across the electronics industry, from vacuum tubes to today’s sophisticated electronics.
The 11th Annual coolingZONE Business and Technology Summit is being held October 5-6, 2011 at the Royal Sonesta Hotel located on the historic Charles River that separates the cities of Cambridge and Boston. Cambridge is major hub for high technology and business education, including MIT and Harvard University.
Advanced Thermal Solutions, Inc (ATS) is a leading engineering/
To register for ATS's full-day course, please visit the coolingZONE Summit web site at http://coolingzone.com/
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ATS - Advanced Thermal Solutions, Inc. - Celebrating 22 years - is a leading engineering and manufacturing Co. supplying thermal and mechanical packaging products for the electronics industry. How to Reach Us:
- email: email@example.com
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