Newly created OEM specialist team at Integral Technology is reaching out with visionary solutions.

Newly created OEM specialist team at Integral Technology is charged with the task of reaching out to OEMs, ODMs and CMs to listen and offer improvement ideas in printed circuit board (PCB) technology.
By: Integral Technology
March 24, 2011 - PRLog -- Jim Griffin, OEM Sales and Marketing Manager, along with Jim Ryan, Vice President Business Development want to talk with you … if you’re into PCB design and manufacturing. They want to hear what you have to say about your future demands and it’s their belief they can offer you some solutions in preventing defects in printed circuit boards to a greater extent than has been accomplished in the past. Griffin’s 30 years experience in board manufacturing, laminate and assembly joined by Ryan’s 25 years PCB manufacturing, contributes insight and credibility when interpreting what OEMs and Circuit Board shops have to face.

“Over these past three months I’ve enjoyed the opportunity to discuss challenges associated with designing a thinner circuit board, and to offer solutions on pad-cratering issues with thirty OEMs, CMs and laboratories across the nation,” enthused Jim Griffin. “ There’s a consistent message, help us re-design a complicated circuit board so it meets the growing demand for a thinner profile, one with strength.”

It has long been held that fiberglass strengthens the construction of printed circuit boards, but it has thickness, and the fibers themselves have led to more pathways for shorts or CAF, (conductive anodic filamentation) because of shrinking architecture. This challenge impedes the advanced development of miniaturization and imposes serious long-term reliability concerns in electronics applications exposed to adverse and hostile environments. Over the years, chip manufacturers have been able to accomplish the ability to shrink, but the circuit board manufacturers have experienced great difficulty reducing the size of the architecture with reliable results.

“As far as offering solutions, ZETA Lam and ZETA Cap from Integral Technology replace fiberglass and have shown marked results. We currently have four re-design projects serving as prime examples, crossing industry platforms in the medical, telecommunication and military markets,” Griffin continued.

ZETA® is a polymer approach to what fiberglass accomplishes. “It’s a tool for OEMs and ODMs to work more effectively together,” explains Chris Hunrath, VP Technology. “This polymer makes higher density circuit structures possible by combining certain properties found in both flex and rigid materials.”

The ZETA® family of products offers solutions to the dilemma by helping PCB shops and OEMs with via filling at lamination, thinner structures, lower Dk and Df, easier drilling and laser, easier plating, and sequential Lam Cycles for HDI applications.

“Another advantage associated with ZETA is that it can be implemented without change to current processes or equipment, and does not require any special equipment. A manufacturer can reap the benefits in using a non-glass product for drilling and plating without any additional investment,” adds Ryan.

Find out for yourself. Integral Technology will be represented at the IPC APEX EXPO in the LCOA Booth #910, held April 12 to 14 at Mandalay Bay Resort in Las Vegas. Meanwhile,

Mr. Griffin and Mr. Ryan are waiting to hear from you.
Mr. Griffin can be reached at 603-738-5821 and Mr. Ryan can be reached at 949-587-3390.

Integral Technology
20322 Windrow Drive, Suite 170 Lake Forest, CA 92630 (949) 587-3370

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Integral Technology is a specialist in printed circuit board manufacturing technology and solutions.
Phone:(949) 587-3370
Tags:Pad-cratering, Hdi, Pcb, Printed Circuit Boards, High Density Interconnect, Electronics, Manufacturing, Laminates, Bonds
Industry:Electronics, Manufacturing, Technology
Location:Lake Forest - California - United States
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