Qpedia Thermal eMagazine Volumes 1-3
March 23, 2011
-- Advanced Thermal Solutions, ATS, has published a three volume set of Qpedia Thermal eMagazine, containing all of the electronics thermal management articles published online in 2008, 2009 and 2010. Each hardbound, full-color book includes a full year’s collection of 48 technical articles, offering expert coverage on topics ranging from new cooling approaches inside chip packages to better thermal management of large modern data centers.
Additional topics include alternative methods for controlling a hot chip’s junction temperature, cooling high power LEDs, and how to characterize – and optimize – the airflow inside an electronics enclosure. Multiple articles explain how to choose and apply the most effective heat sinks. Additional features show how to address the thermal challenges of multi-core processors.
Most of the articles in this useful collection are written and edited at the engineer-level by the thermal and mechanical engineers from Advanced Thermal Solutions, including Kaveh Azar, Ph.D., the company’s president and CEO; and Bahman Tavassoli, Ph.D., its chief technologist. Both Drs. Azar and Tavassoli are internationally recognized experts in the thermal management of electronics.
Qpedia Thermal eMagazine, Volumes One, Two and Three can be purchased for immediate delivery from the ATS website. Each volume is available separately and discounts are available on multiple volume orders. See http://qats.com/Qpedia/Books/47.aspx
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ATS - Advanced Thermal Solutions, Inc. - Celebrating 22 years - is a leading engineering and manufacturing Co. supplying thermal and mechanical packaging products for the electronics industry. Contact firstname.lastname@example.org or visit our website at www.qats.com