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Thermal Management Webinar Series for 2011 Announced by Advanced Thermal Solutions
Advanced Thermal Solutions has announced its 2011 thermal management webinar series. The no-cost to attendees webinars features professional level training on thermal analysis, engineering, “how to” and cooling solutions for electronics
The 2011 ATS webinar series is the sixth edition of this electronics cooling program. This year ATS will also separately present two of these webinars for engineers in China. Their visuals and narration will be provided in Mandarin Chinese by a fluent ATS engineer.
Following are the dates, times and topics of the ATS 2011 thermal management webinars:
January 27, 2011, 2:00 p.m. (EST): Electronics Cooling Technologies Update - What’s New in Thermal Management Options
The market is saturated with cooling options for thermally managing electronic systems. Choosing the right cooling solution is a challenging task for engineers who are not actively involved in thermal management. This webinar reviews all market current cooling options and their most important features. Practicing engineers will receive a strong overview of what’s new in the cooling market, and the capabilities and limitations of each option.
February 24, 2011, 2:00 p.m. (EST): Heat Sink Selection Made Easy
Choosing the right heat sink the first time is essential. With so many application requirements and heat sink options, this can be a daunting task. In this webinar, attendees will learn about the importance of system airflow and its impact on heat sink design; attachment methods and how to solve thermal and mechanical design challenges; and how to make the right off-the-shelf or custom heat sink choice for your application and budget.
March 24, 2010, 2:00 p.m. (EST): Heat Sink Materials: Choices and Tradeoffs
Aluminum and copper are the common choices when designing a heat sink -- but are there better choices based on a metal’s ability to transfer heat? In this webinar attendees learn about other materials options for heat sinks, and the importance of material thermal conductivity in a specific heat sink application. They learn how to consider the benefits and trade offs of these materials, and how current trends in CPU core density affect thermal conductivity.
April 28, 2010, 2:00 p.m. (EST) in English, and at 8:00 a.m. (Chinese Standard Time) in Mandarin: How to Properly Measure Temperature within Electronic Systems and Analyze the Results
Attendees will become familiar with the importance of temperature measurement in electronic systems. They will learn about the essential instruments and the locations within a system where testing should be conducted. The webinar presenter will also discuss how to analyze the temperature data as part of a complete thermal analysis.
May 26, 2011, 2:00 p.m. (EST) in English / 8:00 a.m. (Chinese Standard Time) in Mandarin: How to Properly Measure Air Velocity within Electronics Systems and Analyze the Results
Attendees will learn the importance of measuring the air velocity inside a system and where these velocities should be recorded. The different types of instruments necessary for obtaining useful measurements are explained with their basic requirements. The webinar explains how an engineer should analyze air velocity data as part of complete thermal analysis.
June 23, 2010, 2:00 p.m. (EST): Tips, Tricks and Techniques for the Best Use of CFD for Heat Sink and System Modeling
Computational Fluid Dynamics (CFD) simulation software is an essential part of the thermal professional’
July 28, 2011, 2:00 p.m. (EST): Thermal Management of Consumer Electronics
Consumer electronics products are featuring increasingly more sophisticated processors, DSPs and FPGAs. They are even being deployed in military and other hostile environments. These sophisticated technologies allow a wide range of features, but they have higher thermal management needs. Attendees will learn the key thermal issues to consider, including the importance of spreading resistance in components, and system thermal management. They will learn thermal stress factors affecting enclosed cabinets and how to manage direct solar load.
August 25, 2011, 2:00 p.m. (EST): How to Decide When You Need to Deploy Liquid for Your Thermal Management
Thermal engineering professionals are becoming more confident employing liquid cooling solutions at device, system, rack, and data center levels. But how do you decide when you need to cool with liquid? How do you find the right liquid cooling system for your application?
September 22, 2011, 2:00 p.m. (EST): How to Develop the Right Thermal Management Solution for Commercial and Consumer LED Lighting Applications
Why does thermal management matter in LED lighting? Excess heat directly affects both short-term and long-term LED performance. The short-term effects are color shift and reduced light output, while the long-term effect is accelerated lumen depreciation and thus shortened useful life. Participants will learn how to diagnose and solve thermal issues in consumer and commercial LED applications.
October 27, 2011 at 2:00 p.m. (EST): Tools and Techniques for the Thermal Management of Small, Medium and Large Scale Data Centers
Datacenters are effectively large scale systems whose components are racks of computers. Novel approaches to cooling datacenters of various sizes are being undertaken today to obtain the best and most green cooling possible. This webinar will consider approaches for small, medium and large scale datacenters to achieve a given datacenters cooling goals.
November 17, 2011, 2:00 p.m. (EST): Understanding and Choosing the Best Thermal Interface Materials to Improve Heat Sink Thermal Performance
To cool hotter components, engineers are turning to larger fans and heat sinks and increased surface areas. The downside is that these hardware changes add significant cost to the design. Alternatively, a cooling system’s performance can be improved just by using a better interface material to lower thermal resistance at the interface of the case and the heat sink. Participants will learn to overcome related thermal challenges by making simple and cost-effective changes in thermal interface materials.
December 15, 2011, 2:00 p.m. (EST): Design Out Your Heat Sinks with Smart PCB Thermal Design
A thermal management strategy is often manifested as a “power” approach, using strong fans and multiple heat sinks. Such tactics appear to quickly solve thermal problems, but they often create costly overruns for a system’s thermal design budget. This webinar discusses how to design for the least number of heat sinks and potentially none at all. A case study will be presented as a model of what can be accomplished by considering the thermal management solution up front in system design.
Each of these thermal management webinars will be presented at no cost to our attendees. Pre-registration is required, which can be done on the ATS website at http://www.qats.com/
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