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MSI IPC Launches WindBOX III with Intel® Core™ 2 Duo for Fanless System
【Taipei, Taiwan】MSI, the global leading brand in motherboard, announced the launch of the upgrade version of WindBOX III (MS-9A35) to IPC market in August, 2010. This is the latest ultra-low power system with fanless solution.
MSI WindBOX III enhances the flexible design for easily changing preferred memory/HDD/mini-
MSI WindBOX Ⅲ supports VESA wall-mount interface for easily mounting flat panel monitors and TVs and various scenarios like digital signage, thin client, and POS with affordable expenditure. Based on endless innovation, MSI keeps providing you more efficient and economical products and being with you to fulfill your demand.
For further product information, please contact: firstname.lastname@example.org
The information provided in this news release is subject to future changes without any further notice; MSI reserves the right of modification or changes to technologies, graphs and text disclosed in this news release.
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About MSI Industrial Platform Computing (IPC)
MSI was founded in 1986 and is one of the world-class IT product leading brands. MSI has over-20-year experience in motherboard manufacturing and has now evolved and grown to become the world’s top 3 largest motherboard manufactures, recognized internationally for high quality and stability by consumer and enterprises. In 2006, MSI entered industrial platform computing (IPC) market with successful and professional experience in motherboard filed, and started providing reliable and customized IPC products with expansion capability. MSI IPC manufactures high quality industrial products in various industrial applications, such as digital signage, automation, medical electronic, ATM, point-on-sale, kiosk, industrial control, gaming and home entertainment