COMBO-LXT base card of COMBOv2 family
June 7, 2010
-- Brno, Czech Republic - INVEA-TECH company has recently deployed to market its second generation of COMBO boards. These boards are designed to address the immediate need for devices capable of wire-speed processing of multi-gigabit network traffic. To cope with this problem COMBO cards are equipped with powerful FPGA chips of Xilinx Virtex 5 family as well as high-speed connectors. Using the connectors variety of interface cards can be enlinked and thus different network types - 1GbE or 10GbE.
Boards of COMBO v2 family offers a number of unique features. COMBO-LXT the COMBO v2 family base card is designed with 100Gbps in mind. To reach this future limit set of high-speed connectors is supplied. Also the FPGA chip located on the card can be reprogrammed without the need to power-up/power-
down the system nor reset. This feature brings important time and money savings during the development cycle.
COMBO-LXT card is equipped with dkbvt the XILINX Virtex5 XC5VLX155T, QDRII RAM and socket for DDR2 SODIMM memory. The interconnection with host system is provided through PCI Express x8 system bus. Also a set of interface card is available as a part of COMBO v2 family. COMBOI-1G4 interface card - a four times 1GbE port. COMBOI-10G2 - a two times 10GbE port.
# # #
NVEA-TECH is an university spin-off company devoted to the development of state-of-the-
art solutions for high-speed network applications. The company was founded in 2007 in Brno, Czech Republic. The founders are private persons together with the UNIS technology partner (founded 1989), Masaryk University and Brno University of Technology.
The main focus of INVEA-TECH is to use programmable hardware (FPGA technology) in the area of security and monitoring of high-speed network applications. The target technologies are Gigabit and 10 gigabit Ethernet. The other focus of our company is to provide tools and devices for FPGA resaerch and development. We are very close in cooperation with CESNET, universities and other R&D partners.