PA&E Announces Hermetic Mate for Souriau’s microComp® Connector Series

PA&E’s new hermetic microComp mate allows Souriau's microComp connector series to be used in electronic packaging applications where hermetic seals are required.
By: Pacific Aerospace & Electronics (PA&E)
 
Oct. 8, 2008 - PRLog -- Souriau’s innovative microComp series of high-density, light-weight, space-saving rectangular connectors can now be deployed in applications that require a hermetic seal, thanks to PA&E’s new hermetic microComp mate.

“The microComp connector series offers a number of unique features, but it wasn’t an option for engineers designing components that required hermetic sealing,” said Ed Phinney, Vice President of Engineering at PA&E. “We partnered with Souriau, and leveraged our expertise in ceramic-to-metal sealing technology, to create a hermetic mate for the microComp line that gives design engineers working in the space and defense industries a new, high-performance, hermetic connector option.”

Souriau’s microComp connector line is well suited to any application that requires a light-weight, high-density rectangular connector. It weighs 60% less and is 25% smaller than standard high-density Sub-D connectors. It can be built with as few as seven or as many as 104 contacts with a contact pitch of 2.0 x 1.7 mm2. The microComp line comes in both space and military grade configurations and each connector offers dismountable contact construction for wiring flexibility

The PA&E microComp hermetic mate can be built to match any microComp configuration. It has a leak rate of less than 1X10-9 cc/second helium at one atmospheric differential pressure thanks to PA&E’s proprietary Kryoflex® polycrystalline ceramic. Kryoflex-sealed connectors provide superior electrical performance -- up to 70 times the current-carrying capacity of conventional products -- while withstanding extreme mechanical and thermal stresses.

These connectors provide an insulation resistance of greater then 5,000 megohms at 500 VDC when tested in IAW MIL-STD 1344, Method 3003. They are built with beryllium copper alloy contacts that are finished in nickel/gold. The microComp mate is designed for aluminum, titanium or iron/nickel alloy applications and has an operating temperature range of -65° C to 200° C.

For more information about PA&E’s custom interconnect products, integrated electronic packaging capabilities or EMI filters product line, contact the company at 509-664-8000 or visit at http://www.pacaero.com.

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PA&E, Inc. manufacturers technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries.
End
Source:Pacific Aerospace & Electronics (PA&E)
Email:Contact Author
Zip:98801
Tags:Connector, Dc Connector, Hermetic, High Density, Kryoflex
Industry:Aerospace, Electronics, Defense
Location:Washington - United States
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