Printed Circuit Board X-Ray Inspection Webinar

ROLLING MEADOWS, Ill. - Nov. 3, 2017 - PRLog -- BEST Inc., along with Nikon Imaging and the SMTA (Surface Mount Technical Association) are pleased to announce a 2 part webinar series on x-ray inspection for printed circuit boards. This webinar, hosted by the SMTA, will be for (90) minutes each on December 6^th and 13^th beginning at noon time CST.  A video invite is here: https://www.youtube.com/watch?v=Va3ysuJRxnw .



This webinar is intended for process engineers, QC inspectors and reliability engineers involved in both electronics and wire harness assembly.

This webinar series will have the following instructional goals:

·  Understand the most important specifications in procuring a modern x-ray machine

·  Understand how x-ray inspection is used to inspect a variety of electronic component body styles including leadless devices, area array devices, high density connectors, throughhole connections and standard SMT components

·  Understand how x-ray inspection is used for inspection, defect analysis and troubleshooting

·  Understand how industry standards tie in with the use of x-ray inspection

Kamran Iqbal, one of the instructors, is a product manager with Nikon Imagining having extensive applications experience within the semiconductor industry, device packaging, SMT, Manufacturing, test and inspection. Bob Wettermann is one of the technical trainers at BEST Inc. a contract PCB rework and repair facility with 20 years of electronics experience and he will be the co-instructor.

Interested parties can go to https://www.smta.org/education/presentations/presentations.cfm#xray to register.