Rehm Thermal Systems: New Technology Brochure with Tips on Producing Complex Boards

Nov. 20, 2015 - PRLog -- They are barely visible to the naked eye and have names like03015 or 01005, but theyare achieving great new things in the world of electronics. The smallest of components, such as microchips,capacitors and resistors, are gaining ground when it comes to the manufacturing of electronic products. They offer new technological solutions andchallenge the industry to make compromises, so as to keep up-to-date with the trend towards miniaturisation. In a joint project, experts from the Fraunhofer Institut (FhG IZM Berlin),Rehm Thermal Systemsand other manufacturers from the electronics industry met to discuss experiences and process recommendations for the production of complex boards, based on the example of the current SIPLACE demo board. The results have been compiled and demonstrated in a practicable way, in a new trade brochure.

Complexboards with an extensive spectrum of componentsmake high demands onplanning and implementation of the manufacturing process.From circuit board tolerances, throughto a stableopening layout of the print templates, to a choice of soldering pasteand a reliablesoldering process– the right decisionsmust be made from the outset.

The ‘Complex Board Project’provided an excellentopportunity to examine in detailthe technologicalchallenges in manufacturingintricately assembledcircuit boards.The focus was on the wide variety of components. Using the SIPLACE demo board example, which contains components withedge lengths of just0.3 mm x 0.15 mm, up to sizes in the centimetre range, critical points were able to be analysed for work witha complexmix of components. The current resultsare now contained in a technology handbook,which has beencompiled by the companies ASM Assembly Systems, ASYS, Christian Koenen, Fraunhofer IZM, Heraeus, Rehm Thermal Systems and TDK Europe. The experts discuss factors in the SMT value chain that need to be observed for a robust manufacturing process. It is the aim of the partner companies to offer electronics manufacturerstechnological and practicablesolution concepts for processing thesmallestof components (e.g.03015) alongside very large components (e.g. transformers) and for making production more efficient and as flawless as possible.