MVP to Demonstrate Diverse AOI Toolbox for Microelectronics and Packaging at Semicon West 2014

Carlsbad, CA: MVP today announced it would be demonstrating the diverse inspection toolbox of the MVP 850G AOI platform at the Semicon West 2014 exhibition. The exhibition is at the Moscone Center, San Francisco from 8-10 July at booth #6367.
 
 
MVP 850G
MVP 850G
CARLSBAD, Calif. - July 3, 2014 - PRLog -- Carlsbad, CA– July 3, 2014: Machine Vision Products today announced it would be demonstrating the diverse inspection toolbox of the MVP 850G Microelectronics and Packaging AOI platform at the Semicon West 2014 exhibition. The exhibition is at the Moscone Center in San Francisco from July 8-10 2014. Machine Vision Products are exhibiting at booth #6367 in the North Hall.

MVP will be demonstrating a wide range of applications at Semicon West. These will include leadframe inspection for die placement, epoxy and wire bond as well as demonstrating new surface inspection capabilities.

In 2014 MVP has continued to push the boundaries of performance, speed and ease of use to a new level on the 850G platform by introducing new hardware such as faster multiprocessor technology and new higher resolution cameras.

MVP has also introduced the 850 DWMS (Die Wire Metrology System) including MVP’s own integrated Magazine handlers for leadframe inspection allowing users to attain a UPH throughput of 25000 and above.

The MVP 850G is flexible within multiple locations of microelectronics and packaging lines. For Lead Frame processes the 850G can be placed Post Die Bonder, Post Wire Bonder or Post Solder Ball Attach. Within Flip Chip processes the 850G can be positioned Post Wafer Bumping, Post Die Placement, Post Underfill and Post Final Packaging. With resolution and repeatability a critical factor, the 850G can be configured to provide a 1um pixel size.

The 850G can be configured for Lot Solutions including Magazine Lifters/Indexers, Jedec Trays, Waffle Packs, and Auer Boats. MVP’s inline solutions allow for both single and dual lane processing, strip handling and in-line wafer handing. MVP also provide custom handling solutions.

In addition the 850G can be configured with post processing tools, including physical defect identification/sorting modules, customizable to customer requirements.

The MVP 850G integrates MVP’s easy-to-use programming tools and analytical process control tools in this platform. This convergence of technology from Machine Vision Products, Inc. delivers the best available combination of defect detection capabilities, metrology for process control and inspection throughput at a low cost of ownership

MVP continues to lead the global inspection arena by developing all of their product offerings. This provides a much better cost structure to the end user. Additionally, because all development is performed in-house, the support structure is second to none. With over 18 years of leadership, MVP is taking multiple steps to continue to provide the overall lowest cost of ownership when compare to any competitor globally. For additional information on this unique solution, please visit us at www.machinevisionproducts.com  or visit us at booth #6367 at Semicon West 2014 where we can discuss your application requirements.

For further information contact:

Email: sales@visionpro.com

Phone: +1-760-438-1138

About Machine Vision Products, Inc.
Machine Vision Products is a market innovator and leader in imaging technologies for Surface Mount, Microelectronics and Packaging Technologies. Machine Vision Products provide solutions for both commercial and military applications. Machine Vision Products operate globally with direct operations in the US, China, Malaysia and the UK, with additional representation in countries throughout North America, Europe and Asia.

www.machinevisionproducts.com

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Tags:Aoi, Semiconductor, Lead Frame, Wire bond, Inspection
Industry:Manufacturing, Semiconductors
Location:Carlsbad - California - United States
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