Thermal Interface Materials (TIMs) are designed to fill in air gaps and microscopic irregularities, resulting in dramatically lower thermal resistance and thus better heat dissipation and cooling.
Techsil introduces 2 new one-component thermal interface materials to the market, striving to find solutions to aid your thermal management.
Techsil TIM11021 (http://www.techsil.co.uk/
- Thermal Management:
- Aerospace & Aviation
- Automotive Electronics
- Healthcare Electronics
- Semiconductor Packaging (Microelectronics)
- Energy, Power & Utilities
- Power Supplies
- Electronics for Hybrid Engine Parts (Automotive)
- Microelectronics Board Assembly
- Consumer Electronics
- Flat Panel Displays
Techsil TIM11123 (http://www.techsil.co.uk/
TIM11123 (GB) does not corrode copper or its alloys and offers excellent primerless adhesion to many substrates when fully cured. It has been designed to be flowable and contains 200 micron glass beads to control bond line thickness. Adhesive TIM11123 (GB) presents good spreading and tooling properties with low linear shrinkage and fast skinning. It will cure through 2 to 3mm in less than 24 hours and its adhesion to most substrates improves with age until most are cohesive.
Both TIM11021 & TIM11123 (GB) are supplied ready to use in 310ml cartridges, no mixing is required reducing wastage and making the product very easy to apply. They can be dispensed using either manual or pneumatic dispensers.
For more information on either product, you can contact the Techsil Technical Team direct:
Tel: 01789 773232