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IPDiA to offer 2.5D Silicon Interposers for Implantable Medical Devices, High Value and High Rel


 
 
Schematic of IPDiA 2.5D interposer with IPD &external active dies in flip-chip
Schematic of IPDiA 2.5D interposer with IPD &external active dies in flip-chip
PRLog - Apr. 30, 2014 - IPDiA, leading manufacturer of passive components, has developed a range of silicon interposers which, when combined with Integrated Passives Devices (IPD) and Through Silicon Vias (TSV), offer an economic model and an evolutionary technological approach perfectly adapted to implantable medical devices and high value applications targeting an higher miniaturization.

These 2.5D Silicon Interposers exhibit outstanding performances that are perfectly fitted with such domains:

Optimized miniaturization and decrease of the total weight of the device thanks to a very high level of integration made possible by the compatibility with Through Silicon Via and Integrated Passive Device technologies.
High stability and high reliability due to a very small CTE mismatch between the substrate and the external ICs (silicon-silicon compatibility).

The figure shows that the silicon not only serves as a redistribution layer but also allows the integration of passive components within the substrate. The copper vias enable higher density and shorter connection lengths compared with wire bonded solutions and are fully matched to face the increasing demand for faster signals and lower power use.

www.ipdia.com

Media Contact
Laetitia Omnes
+33 231 535 406
laetitia.omnes@ipdia.com

Photo:
http://www.prlog.org/12316961/1

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Contact Email:
***@ipdia.com
Source:IPDiA
Country:France
Industry:Electronics, Technology
Tags:ipdia, interposers, tsv, passive components, silicon components
Shortcut:prlog.org/12316961
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