These 2.5D Silicon Interposers exhibit outstanding performances that are perfectly fitted with such domains:
Optimized miniaturization and decrease of the total weight of the device thanks to a very high level of integration made possible by the compatibility with Through Silicon Via and Integrated Passive Device technologies.
High stability and high reliability due to a very small CTE mismatch between the substrate and the external ICs (silicon-silicon compatibility)
The figure shows that the silicon not only serves as a redistribution layer but also allows the integration of passive components within the substrate. The copper vias enable higher density and shorter connection lengths compared with wire bonded solutions and are fully matched to face the increasing demand for faster signals and lower power use.