ATS’ patented maxiFLOW™ heat sinks with superGRIP™ clip attachment ensure long-term product reliability and maximum performance from the Sitara ARM Microprocessors. maxiFLOW™ high performance BGA heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection air cooling. The unique maxiFLOWTM design provides thermal performance that is 30–200% better than conventional heat sinks.
maxiFLOW is available with pre-assembled phase change material, maxiGRIP™ clip attachments, and superGRIP™ clip attachments. The superGRIP™ attachment system features a plastic frame clip that fastens securely around the perimeter of a component and a metal spring clip that slips through a heat sink’s fin field and locks securely to both ends of the plastic frame. The resulting superGRIP™ assembly applies steady even pressure to the component throughout the product lifecycle, improving thermal performance and long-term reliability. ATS’ superGRIP™ heat sink attachment system permits the use of high performance phase changing thermal interface materials that improves heat transfer by as much as 20 times more than typical double-sided adhesive thermal tapes. It also allows for the heat sink to be detached and reattached without damaging the component or the PCB, an important feature for applications where PCB rework and ease of assembly and disassembly are important. The full range of ATS products compatible with Texas Instruments products can be viewed in the new heat sink selection tool on http://qats.com/
To learn more about maxiFLOW™ heat sinks and the superGRIP™ clip attachment, please visit www.qats.com, email firstname.lastname@example.org, or call 781-769-2800.