Micromachining Leader Expands Silicon Wafer Cutting Capabilities

July 27, 2012 - PRLog -- Lanham, MD, July 2012: Potomac Photonics is pleased to announce that it has recently added a new laser system capable of high speed machining of polycrystalline silicon material.  

This process has been integrated into a system that is equipped with high precision stages and is optimized for small hole drilling and high precision cutting applications.  All that is required to get started on a project is a drawing or CAD file.

Feature sizes as small as 150 microns can be achieved in materials as thick as 1mm. with extremely smooth edges and minimal microfractures.  For customers that require smaller features, Potomac has another system that can machine features as small as 25 microns, however the cutting process is slower than on the new system.  Medical Device, Biotech, Electronics, Alternative Energy, Automotive and Consumer Goods are among the many industries that will be able to outsource their prototyping and production projects to Potomac Photonics, which is ISO 9001:2008 and ISO 13485:2003 certified.  

“We are very pleased to add this high speed silicon wafer cutting process to our expanding list of micro machining capabilities,” stated Greg Behrmann, Chief Technology Officer, Potomac Photonics.

For almost 30 years, Potomac Photonics has been a leader in microfabrication and small hole drilling. Potomac’s contract services span prototyping to production, helping clients develop miniature products and bring them to market. Potomac is an authorized distributor for high-tech manufacturing technologies such as 3D printer and laser systems. Using cutting-edge manufacturing technology, Potomac has been recognized by both commercial and government agencies for innovation in areas such as medical device, electronics, aerospace, and automotive manufacturing.  Visit the website at www.potomac-laser.com