A four hour course, taught by Professor Al Ortega, Ph.D., coolingZONE-
- Become familiar with the market and technology drivers that are exacerbating power consumption and local heat fluxes in semiconductor devices and systems thereby requiring strategic transitioning from primarily air-cooled systems to systems that use liquid cooling.
- Learn about the generally accepted methodologies, models and correlations useful for conventional and advanced air- and liquid-cooled heat exchangers such as heat sinks and cold plates.
- Become better acquainted with the theory of compact heat exchangers and how it applies to heat sink and cold plate design.
- Know where to find reliable design and validation data, and how to conduct bench-top experimentation when it does not exist
- Understand how to approach the transition from air-cooled to liquid-cooled systems design at the component, module, and box levels and its implications on the server box-level form-factor including both thermal (heat exchanger design) and hydraulic design (manifold design).
Avram Bar-Cohen, Ph.D., will speak on “Intrachip Microfluidic Cooling - Gen3 Thermal Packaging Technology”. In his talk, following a brief history of thermal packaging, attention will turn to a review of emerging DARPA-driven micro- and nano-technologies for reducing the thermal resistance of defense electronic systems. The asymptotic maturation of current technology and growing thermal management demands in high performance computing and RF systems have led DARPA to initiate efforts in third-generation thermal management technology based on intrachip and interchip microfluidic cooling. The motivation, technological thrusts, and promise of this new thermal management paradigm will be discussed.
Michael M. Ohadi, Ph.D., will present on “Next Generation Embedded Liquid Cooling with Ultra Low Thermal Resistance”. In his presentation, he will discuss the demand for increased functionality of electronic products and the simultaneous trend of smaller feature size. This approach continues to raise dissipated power and the resulting power densities in electronic systems, introducing new challenges and opportunities in thermal management of modern electronics. Successful next generation thermal management systems will have to mitigate thermal limitations on the operation of high performance electronic systems to satisfy the increasing market demand for faster, smaller, lighter, and more energy efficient and cost effective products. The next generation cooling systems will integrate the thermal management techniques into the chip layout, and/or package design, to provide substantially enhanced cooling performance with ultra-low thermal resistance between chip-level heat generation and system-level heat removal path. This presentation will review most recent progress in embedded micro cooling systems, including use of use of thin film micro channel cooling. The technique involves utilization of 3-D structures and a distributed liquid delivery, with dedicated channels for vapor and liquid to maximize phase change heat transfer while facilitating isothermalization of the surface and minimizing the pressure drops and the associated pumping power requirements. Record-high heat transfer coefficients have been experimentally demonstrated with heat removal capability in excess of 1 kW/cm2 and heat density of 1 kW/cm3.
Mechanical engineers who participate in these sessions will get a clear understanding of what it takes to move to liquid cooling in their projects today as well as understand the future of where liquid cooling is moving to.
For all attendee pricing, online registration and more information, see the coolingZONE-
There are a limited number of spots for exhibitors to this engineering focused show. Exhibitors should contact John O’Day at email@example.com or at 1-508-329-2021 or visit the coolingZONE-