ATS’s Thermal Characterization Lab features a full range of research-quality instruments, including open and closed loop wind tunnels for ambient and elevated temperature testing. All wind tunnels feature PC-driven controls and provide automated data collection. The Lab also uses the full array of the company’s sensor systems, including ATS’s Spot Sensor and Candlestick Sensor, as well as thermocouples, to characterize electronic products under variable airflow and temperature conditions.
ATS recently added the state of the art iQ-200 instrument to its thermal characterization lab. . The iQ-200 system measures temperature, air velocity and pressure at multiple points, simultaneously. This approach dramatically cuts the time it takes to perform the most important thermal analysis measurements.
The ATS Thermal Characterization Lab includes a JEDEC-approved component thermal testing facility for conducting a multitude of device-level tests per JEDEC standards. There are also complete liquid crystal and IR thermography systems for non-invasive temperature mapping to 0.1°C with one micron-level spatial resolution; and a liquid cooling facility, featuring ATS’s latest cold plate tester, the iFLOW-200. The iFLOW-200 gives ATS the ability to perform complete testing and characterization of cold plates.
ATS’s staff of professionals includes doctorate-level thermal engineers and experienced technicians adept at both simulated and physical testing regimens using a full range of research-quality instruments. Thermal analysis services encompass both experimental and computational simulations using proprietary tools and computation fluid dynamics software packages such as, 6SIGMA, Icepack, FLOTHERM, CF design, and Direct Numerical Simulation (DNS)
ATS provides detailed test and design reports, including computational fluid dynamic (CFD) images of components and board areas, and visual demonstrations of improved airflow across the PCB landscape. Thermal data are provided for all components requiring cooling assistance. When necessary, ATS recommends specific heat sinks or other cooling methods to bring a PCB within its required thermal range.
ATS also offers a half-day of free, no-obligation use of its uniquely-equipped Thermal Characterization Laboratory to engineers who need to perform thermal testing of heat sinks, fans and fan trays, PCBs, blades, enclosures, or complete systems. Experienced engineers and board and system designers can perform the tests themselves or consult with an ATS thermal engineer at no cost during their 4 hours of laboratory time.
To learn more about ATS thermal characterization services, please visit our web site at: http://www.qats.com/
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ATS - Advanced Thermal Solutions, Inc. - Celebrating 22 years - is a leading engineering and manufacturing Co. supplying thermal and mechanical packaging products for the electronics industry. Contact email@example.com or visit our website at www.qats.com