The innovative Therm-Jet™ cooling system is capable of dissipating 1 KW to 2 KW of heat in a 1-U form factor. Lab tests have demonstrated that four heat sinks on four simulated chips located on a PCB have achieved 0.16 to 0.18 C/W thermal resistances. The power dissipation of each simulated component was tested at 200 W. This compares very favorably versus the thermal resistances of the same heat sinks with parallel flow using the same fans. Results of side by side testing in ATS’s lab showed that Therm-Jett enabled systems to be almost 20 to 40% better than a 1U blade without Therm-Jet.
The ATS technology uses a specially made duct with an impingement plate under it to create jet impingement on top of the components and heat sinks. The tremendous increase in heat transfer coefficient causes the new system to significantly increase the power dissipation of the 1U compared to other conventionally cooled 1U chassis.
Therm-Jett can be custom configured for a variety of blade types and topologies. The impingement duct is less than 5 mm thick and is located in a chassis on top of the motherboard. A key advantage of Therm-Jet is there won’t be a need to make a special duct for each heat sink freeing the other board for other components.
ATS has a white paper available on their Therm-Jett technology. To get a free copy from them, email firstname.lastname@example.org requesting their Therm-Jett white paper.
ATS is a leading engineering/
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ATS - Advanced Thermal Solutions, Inc. - Celebrating 22 years - is a leading engineering and manufacturing Co. supplying thermal and mechanical packaging products for the electronics industry. Contact email@example.com or visit our website at www.qats.com