NEPCON South China 2011 to Focus on New Product Innovations

Aug. 1, 2011 - PRLog -- Taking place from August 30 to September 1 at the Shenzhen Convention & Exhibition Center, NEPCON South China 2011 will span nearly 30,000 sqm and attract more than 500 exhibitors from 22 countries and regions. It is estimated that more than 1,000 pieces of electronics manufacturing equipment will be displayed and demonstrated onsite. Show exhibitor Reed Electronics will use this platform to introduce a full range of technology and products for electronics assembly and manufacturing, providing a valuable opportunity for trade professionals to find advanced new solutions as well as the latest technologies.

Each year, NEPCON South China brings together thousands of decision makers, engineers, technicians and buyers for three days of nonstop business under one roof. Reed Exhibitions is expecting 26,000 industry leaders and buyers at the show. Together with the steady development of China’s electronics and information products market, many famous manufacturers from around the globe hasten to promote new products in China.

As one of the most important trading platforms of China's electronics manufacturing industry for multinational and domestic purchasing, NEPCON South China has become the preferential platform for manufacturers to release their new products. A sampling of what will be found on the show floor at the end of August follows.

Device programmer BPM Microsystems will unveil the 2800 to the Chinese market in booth #1H43. As the newest addition to its manual universal device programmer family, the 2800 combines the unrivaled speed of Vector Engine Co-Processor® technology plus true universal device support, resulting in the fastest universal programmer in the industry.

In booth #1J50, Kyzen will debut Aquanox® A4638, an engineered electronics assembly and advanced packaging cleaning agent that removes flux residue from flip chip and low clearance components as well as water-soluble polar flux residues at low concentrations.
   
In booth #1E20, Sony Manufacturing Systems Corporation will showcase two innovative systems: The SI-G200MK5 is a high-speed electronic part mounter that realizes maximum 66000 CPH high-speed mounting, and the SI-V200SPI 2-/3-D Hybrid Solder Paste Inspection Machine provides all post-inspection solder paste printing on one machine.

Indium Corporation will introduce SAC105+Mn, which is the industry’s first reliable, lead-free, low-Ag alloy, in booth 1J30. The material features thermal cycling comparable to, and drop testing significantly better than, SAC305. Its thermal reliability characteristics are comparable to, and in some cases better than, standard high-cost, high-silver solder alloys. Additional attributes include drop shock reliability better than SAC105 for the handheld device market, reduced environmental impact and reduced silver content for decreased price volatility.

MX500™ is the SMT Industry’s first fully modularized AOI system that offers scalability and flexibility for line expansion using an innovative multi-lane approach. CyberOptics (China) Company Ltd’s MX500™ offers a horizontal-stackable conveyor system with a primary inspection lane that can be coupled with additional lanes to support dual, triple and quad-lane configurations. Visit its premier in booth #1C43.

Other notable products to be introduced include American Tec Co Ltd’s Jutze MI-3000/LI-2000 high-speed, high-precision XIA series Inline AOI in booth #1F50; ZESTRON Trading (Shanghai) Co Ltd’s ATRON® AC 207 fast, technology-based cleaning agent designed to operate at low concentration levels in booth #1C40; AIM Solder (Shenzhen) Co Ltd’s NC258 halogen-free, halide-free solder that enhances fine print definition even on the finest pads in booth #1E05; ASYS Group’s INSIGNUM2000 in/offline laser marking system for direct marking on solder resist on PCBs in booth 1G50; and Cookson Electronics – ALPHA’s SACX Plus Alloy that delivers excellent soldering performance and is highly reliable compared to more expensive high silver alloy options in booth #1H05.

For more information, please contact:

Reed Exhibitions              
Karena Tong   
Tel：+86 21 5153 5210               
Fax: +86 21 5153 5234
Email: karena.tong@reedexpo.com.cn      

MW Associates
Ida Wang
Tel：+86 13910227049
email: iwang@meganwendling.com

About Reed Exhibitions – Asia’s Electronics Event Experts
Reed Exhibitions is the world’s leading events organizer. Today Reed’s events are held in 38 countries throughout the Americas, Europe, the Middle East and Asia Pacific, and organized by 39 fully staffed offices.

Reed Exhibitions is committed to serving the electronics industry over the long term. We deliver 12 quality electronics events in eight Asian countries. These events bring together nearly 6,000 exhibitors and over 200,000 buyers. By organizing leading events in the region, such as InterNEPCON (Japan), NEPCON China, NEPCON India, NEPCON in Korea and GlobalTRONICS in Singapore, we demonstrate our commitment to the highest standards of quality and customer care and work with the very best domestic partners to deliver our events. Our exhibition specialists are always pleased to leverage their skills and share their best practices for the benefit of our customers. So, wherever you want to do business, you will experience the same quality events and high standards of service and professionalism.