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Follow on Google News | Review of Test Equipment for Thermal Interface Material and More in June Qpedia Thermal eMagazineQpedia Thermal eMagazine this month features articles on Modern test equipment for TIM Testing, and the Effects of Different Compounds & Cooling Enhancements on the Thermal Resistance of a Stacked Die.
By: Advanced Thermal Solutions, Inc. The quality of thermal interface materials (TIM) has become increasingly important as the ever increasing thermal dissipation level of IC’s requires more sophisticated solutions to reduce the thermal resistance R(th) along the heat-flow path. TIM manufacturers have considerably enhanced TIM’s thermal conductivity by using nanoparticles as fillings in new TIM materials. Thermal interface materials (TIMs) are placed between electronic devices and their heat sinks to enhance heat transfer. Thus for electronics cooling, it is necessary to know the TIM thermal resistance. Most of the TIM’s characterization methods are based on the ASTM standard D14570. According to ASTM D14570, a TIM sample is placed between a hot and a cold meter bar with a constant heat flux being applied. The thermal resistance of the sample TIM is calculated from the known heat flux forced through the tester and from the measured temperature drop, including the contact resistance of the TIM to the tester. However, there are difficulties in the characterization of new TIMs, especially for TIMs that are made of advanced interface materials: because their thermal resistances approach zero. This requires new kinds of equipment to test these materials. Our review article includes Trinitiy College and Alcatel-Lucent’ The new edition of Qpedia emagazine is available at http://qats.com/ # # # ATS - Advanced Thermal Solutions, Inc. - Celebrating 22 years - is a leading engineering and manufacturing Co. supplying thermal and mechanical packaging products for the electronics industry. How to Reach Us: - email: ats-hq@qats.com - website at www.qats.com - Blog at http://www.qats.com/ - Twitter @qats End
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