Currently, heat pipes are commonly used to transport the heat from the high power components to a remote heat exchanger. The heat is then dissipated to the air passing through the remote exchanger. However, the heat dissipation using a heat pipe is approaching its effective limit due to the size restrictions of a notebook-shape form.
Thermoelectrics and refrigeration have been shown to achieve the required dissipation rates, while satisfying the required reliability and cost considerations for these products. Given the small cooling capacity and low efficiency of thermoelectrics, a refrigeration system is the only viable method to further increase the heat dissipation of high power components in notebook computers.
Refrigeration cooling allows high heat ﬂux dissipation at low junction temperatures, which will increase microprocessor performance at lower operating temperatures and increase chip reliability.
However, the article explains, refrigeration cooling also increases the size, complexity and cost of the cooling system. The added complexity can increase the uncertainties in the system reliability.
Along with the technical feature on laptop cooling by refrigeration, the new issue of Qpedia includes articles on ATCA standards, thermal simulation and management of 3D stacked chips, and a review of the JEDEC industry standards for compact thermal modeling.
The new edition of Qpedia emagazine is available at http://qats.com/
# # #
ATS - Advanced Thermal Solutions, Inc. - Celebrating 22 years - is a leading engineering and manufacturing Co. supplying thermal and mechanical packaging products for the electronics industry. How to Reach Us:
- email: email@example.com
- website at www.qats.com
- Blog at http://www.qats.com/
- Twitter @qats