Update of the WinCE 6.0 R3 Unified BSP for Texas Instruments Cortex-A8 Solutions

PRLog (Press Release) - Jun. 7, 2011 - TI released two weeks ago an updated version of their Windows Embedded CE 6.0 R3 software development kit (SDK) for OMAP35x, AM35x and AM/DM37x processors including the Adeneo Embedded unified board support package (BSP) with new features.

This SDK includes our updated unified BSP that has the following improvements:

>>Support for BinFS and multiple bin. This feature helps in reducing the boot-up time;

>> Ability to change the CPU frequency from eboot;

>> BSP Bug fixes – see BSP release notes for details.

This Windows Embedded CE 6.0 SDK is available for free from the Texas Instruments' website: http://focus.ti.com/docs/toolsw/folders/print/wincesdk-a8.html#3

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System integrator focusing on the development of complete 32-bit embedded systems from OS bring-up, board support package and driver adaptation to application development