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Update of the WinCE 6.0 R3 Unified BSP for Texas Instruments Cortex-A8 Solutions

The Adeneo Embedded unified BSP for Texas Instruments Cortex-A8 solutions has been updated in the official SDK delivered by TI

 
PRLog - Jun. 7, 2011 - TI released two weeks ago an updated version of their Windows Embedded CE 6.0 R3 software development kit (SDK) for OMAP35x, AM35x and AM/DM37x processors including the Adeneo Embedded unified board support package (BSP) with new features.

This SDK includes our updated unified BSP that has the following improvements:

>>Support for BinFS and multiple bin. This feature helps in reducing the boot-up time;

>> Ability to change the CPU frequency from eboot;

>> BSP Bug fixes – see BSP release notes for details.

This Windows Embedded CE 6.0 SDK is available for free from the Texas Instruments' website: http://focus.ti.com/docs/toolsw/folders/print/wincesdk-a8.html#3

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System integrator focusing on the development of complete 32-bit embedded systems from OS bring-up, board support package and driver adaptation to application development

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Contact Email:
***@adeneo-embedded.com Email Verified
Source:Adeneo Embedded
Phone:+33426492328
Zip:69134
City/Town:Ecully - Rhone-Alpes - France
Industry:Electronics, Semiconductors, Software
Tags:adeneo, texas instruments, unified, bsp, sdk, wince, omap, sitara, davinci
Shortcut:prlog.org/11529573
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