With a maximum system temperature of 320°C, reflow profiles can be optimized on the new ERO-500 Reflow Soldering System for lead-free and lead solder profiles. Each heating zone is independently programmable and easily controlled through the on-board LCD system controller. Optimizing reflow profiles can be accomplished with maximum flexibility in defining a reflow profile's conveyor speed, heating temperature, convection heat flow, and cooling fans.
Plenum convection heating technology provides uniform temperature profiling across the PCB board for enhanced SMT process control. Reflow profiling is capable with on-board programming and ability to attach three (3) thermocouples to the board. A data port is included for downloading of profile data and error logs.
"The ERO-500 rounds out our reflow oven product line. We can now offer SMT OEM assemblers looking for solutions to their small and medium volume production or prototyping needs with a full range of reflow oven products to address their specific applications,"
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About APS Novastar
APS Novastar, LLC established in 1982, recipient of a 2009 Frost & Sullivan Best Practices Award, is the global leader in the design, development and manufacture of OEM equipment for the short to medium run surface mount technology (SMT) and printed circuit board (PCB) markets. APS Novastar's products include stencil printers, automated pick and place robots, reflow ovens, wave and selective solder equipment, component counters and lead forming equipment. APS Novastar has installed over 20,000 products solutions in the telecom, defense and aerospace, security, transportation, automotive, medical device and diagnostics, personal computer, display and academic markets. For more information, visit http://www.apsgold.com or call +1.215.938.1000.