STI Electronics to Feature Engineering Services at Space & Missile Defense Conference & Exhibition

PRLog (Press Release) - Jul 26, 2010 -
MADISON, AL — STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, will feature its key engineering services at the upcoming Space and Missile Defense Conference and Exhibition, scheduled to take place August 16-19, 2010 at the Von Braun Center in Huntsville, AL.

STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as Chip-On-Board (COB) and Multichip Module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).

The Engineering Services division is a multifaceted technical organization whose common goal is to provide engineering support in the field of small to medium volume electronics manufacturing as well as microelectronics and hybrid assemblies in a certified class 1000 cleanroom. STI also specializes in military contract electronic assemblies and failure analysis.  From product design and manufacturability analysis to pre-production prototype and development, STI’s Engineering Services division is equipped to support its customers.

For more information about STI Electronics Inc., visit http://www.stielectronicsinc.com.