Dr Alan Brown, Director of Development, at CERAM and author of the paper explains: “Semiconductor device technology is continually being scaled to smaller dimensions which results in greater device density and higher switching speeds. With this advancement there has been a demand for new materials to counteract the effects of these shrinking dimensions. At the same time, developments in solar research and optoelectronics have also produced a new range of compound semiconductor based devices with complex thin layer structures. Techniques that facilitate an analysis of surface composition and an understanding of their functionality are proving to be vital in supporting these technological developments.”
The white paper provides an insight and summary into how a range of analytical protocols using Secondary Ion Mass Spectrometry (SIMS) and other surface analysis techniques are providing professionals in the semiconductor and related industries with solutions to challenges that arise during product development, process improvement, reverse engineering and failure analysis.
CERAM offers expertise and technologies that specialise in surface and interface analysis for semiconductor devices; multi-element depth profiling; elemental and molecular imaging; surface topography; materials selection and characterisation;
The white paper is available as a free download at: www.ceram.com/
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CERAM is a global expert in materials testing, analysis and consultancy, providing customised solutions that help clients to measurably improve performance and profitability through safer, regulatory-compliant and better-engineered products. Setting new standards in materials testing, CERAM works as an extension of customers’ teams, applying its expertise and capabilities to a wide range of sectors, including aerospace & defence; automotive & transport; construction;
Headquartered in Staffordshire (UK), CERAM was founded in 1920 and employs a team of research and product development professionals who are involved in physical and chemical materials testing, research, process engineering, product design and failure analysis.