The paper was written by Mike Bixenman, D.B.A., Kyzen Corporation and Rich Brooks, Kyzen Corporation and will be presented at the upcoming NEW exhibition scheduled to take place May 18-19, 2010 in Hall 1, National Exhibition Centre, Birmingham, England. The presentation will take place on Tuesday May 18, 2010 from 11-11.45 a.m.
Manufacturers of printed circuit assemblers are challenged with a continuous stream of technology advances to improve performance, increase through put, and efficiency. Electronics innovations are enabled by miniaturization of components and devices. In the age of no-clean and lead-free soldering, assemblers need manufacturing flexibilities to clean stencils, populated surface mount, through-hole assemblies, and re-work boards.
Engineering Cleaning Fluids are typically designed for specific equipment and applications. This paper introduces an innovative aqueous cleaning fluid designed for use in batch and continuous inline equipment that works for cleaning stencils, populated surface mount and through-hole assemblies, and re-work boards.
For further information, please visit Kyzen’s distributor’
