PRLog - Oct. 15, 2008 - WENATCHEE, Wash. -- Engineers designing electronics that require high-bandwidth fiber optic connectivity and that must operate reliably in harsh conditions can now take advantage of the PA&E’s new FC/APC fiber optic bulkhead connector. This new hermetic connector can deliver new levels of reliability because it is designed to be laser welded into lightweight titanium or aluminum housings, thereby eliminating a key point of failure: solder joint fatigue.
FC/APC Fiber Optic Bulkhead Connector from PA&E
“PA&E has been manufacturing single-channel and multi-channel fiber-optic connectors for our military, telecommunication, medical and commercial customers for years,” said Ed Phinney, Vice President of Operations at PA&E. “This latest FC/APC bulkhead connector is a great addition to our line and will offer our customers new levels of performance and reliability.”
This new fiber optic connector uses PA&E’s patented Kryoflex® polycrystalline ceramic-to-metal sealing technology to achieve a leak rate less than or equal to 1X10-9 cc/sec He at one atmospheric differential pressure. These connectors provide a minimum return loss of 70 dB and a maximum insertion loss of 0.3 dB per interface. This connector exhibits no breakdown in performance within a standard operating temperature range of -40C to +150°C and is capable of meeting 1,000 mate/de-mate cycles over its service life.
The connector body is made of 300-series stainless steel, which is laser weldable to either aluminum or titanium by means of an explosion-bonded metal transition bushing. The industry-standard FC/APC interface features a zirconia ferrule with an 8° angled convex polish, an anodized aluminum nut and Corning® SMF-28™ single-mode fiber.
For more information about PA&E’s fiber optic connector line or to learn more about Kryoflex®, or the company’s interconnect products, EMI filters and integrated electronic packaging capabilities, contact PA&E at 509-664-8000 or visit us at http://www.pacaero.com.
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PA&E, Inc. manufacturers technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries.