3D-TSV Technologies set to have Significant Impact on the Semiconductor Business

PRLog (Press Release) - Aug 29, 2008 -
Report Buyer, the online destination for business intelligence for major industry sectors, has added a new report evaluating the impact of 3D-TSV (Through Silicon Via) technologies on semiconductor business, at the device, equipment and material levels.

The report “3D-TSV Interconnects - Devices & Systems 2008” available at http://www.reportbuyer.com/go/YOL00088 aims at giving a better understanding of the right time line for the successful adoption of the 3-D TSV interconnect technology across the wide range of its driving end-applications. It specifies the potential impact of 3-D technologies on the semiconductor manufacturing market and evaluates how the industry supply chain is likely to evolve in the 2006-2015 time frames.

According to the report, the Semiconductor manufacturing industry is today facing more than ever the challenge to explore the so-called More-than-Moore 3-D integration route in order to pursue the aggressive scaling of the historical Moore’s Law. As the whole of the semiconductor industry supply chain is concerned, all players are positioning on the technology and evaluating which 3-D technology platforms need to be invested and developed for their own business. Authors of the report therefore suggest that 3D integration with TSVs could help accelerate the current consolidation happening in complementary metal–oxide–semiconductor (CMOS) wafer fabs and the shift toward a fabless foundry model.

The report will benefit the reader, by providing and evaluating a range of key topics, including:
- An overview of the different 3D & TSV packaging approaches (SoC, SiP).
- The market drivers and market forecasts for 3D ICs & TSVs.
- The 3D IC & TSV players, roadmaps.
- The evolution of the business models (OSAT, IDMs, wafer fabs).
- How the adoption of 3D stacking and TSV could significantly change the standard semiconductor process.
- The 3D IC and TSV wafer, equipment and material market forecasts.
- An analysis of the COO for different technical solutions.

The report targets both device manufacturers and packaging companies as 3D & TSV will be such a breakthrough for packaging that developments are running independent of the activity of the semiconductor companies. It is of great interest for equipment manufacturers, as new investments are planned to implement all the 3D & TSV technological steps in the near future. Furthermore, the report will offer the reader an insight into markets and technological challenges for 3D & TSV integration.

“3D-TSV Interconnects - Devices & Systems 2008” is available from Report Buyer. For more information, go to: http://www.reportbuyer.com/industry_manufacturing/packagi...

Report Buyer product ID: YOL00088

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