The BONDJET BJ820 is a high-speed fully automatic wedge bonder that offers the flexibility for both high-speed round wire and deep access ribbon and wire bonding. It handles all challenging fine pitch wire bonding applications in a single platform - including RF and microwave devices, COB, MCM and hybrids, fiber optics and automotive - using aluminum or gold wire or ribbon up to 6 wires/second. The looping profiles and height consistencies offered by the BONDJET BJB20 meet and exceed RF/Microwave Market expectations.
With high repeatability of 1μm at a balanced encoder resolution of 20nm, the BJ820 BONDJET offers increased process stability that enables reliable bonding of extremely small bond pads with a larger wire diameter. An efficient 12” x 16.1” work area can serve as two or more smaller stations for efficient handling of smaller products or substrates. Coupled with intelligent automation solutions, these features eliminate significant indexing time, resulting in 60% greater throughput than competing machines.
“The BONDJET BJ820 offers very high repeatability for high volume production environments and a large control work area for both wire and ribbon bonding, offering greater throughput than competitive technology,”
Other significant machine capabilities include:
· 12.5μm to 85μm diameter wire bonding
· Ribbon bonding from 6μm x 35μm to 25μm x 250μm
· Constant loop height and wire length
· Maintains parallel loops within mixed reference system
· Auto teach for linear applications, reducing programming time
With a footprint of only 720 x 1250 mm, the BONDJET BJ820 can be easily integrated into existing floor plan configurations or new concepts. For more information on the BONDJET BJ820, email us at info@hesse-knipps.us or refer to our web site at http://www.hesse-
